Integrated Circuitry, Method Used In The Fabrication Of A Vertical Transistor, And Method Used In The Fabrication Of Integrated Circuitry

ABSTRACT

Integrated circuitry comprises an electronic component. Insulative silicon dioxide is adjacent the electronic component. The insulative silicon dioxide has at least one of (a) and (b), where: (a): an average concentration of elemental-form H of 0.002 to 0.5 atomic percent; and (b): an average concentration of elemental-form N of 0.005 to 0.3 atomic percent. Other embodiments, including method, are disclosed.

TECHNICAL FIELD

Embodiments disclosed herein pertain to integrated Circuitry, to methodsused in the fabrication of a vertical transistor, and to methods used inthe fabrication of integrated circuitry

BACKGROUND

Memory is one type of integrated circuitry and is used in computersystems for storing data. Memory may be fabricated in one or more arraysof individual memory cells. Memory cells may be written to, or readfrom, using digitlines (which may also be referred to as bitlines, datalines, or sense lines) and access lines (which may also be referred toas wordlines, gatelines, or gate lines). The digitlines may conductivelyinterconnect memory cells along columns of the array, and the accesslines may conductively interconnect memory cells along rows of thearray. Each memory cell may be uniquely addressed through thecombination of a digitline and an access line.

Memory cells may be volatile, semi-volatile, or non-volatile.Non-volatile memory cells can store data for extended periods of time inthe absence of power. Non-volatile memory is conventionally specified tobe memory having a retention time of at least about 10 years. Volatilememory dissipates and is therefore refreshed/rewritten to maintain datastorage. Volatile memory may have a retention time of milliseconds orless. Regardless, memory cells are configured to retain or store memoryin at least two different selectable states. In a binary system, thestates are considered as either a “0” or a “1. In other systems, atleast some individual memory cells may be configured to store more thantwo levels or states of information.

A capacitor is one type of electronic component that may be used in amemory cell. A capacitor has two electrical conductors separated byelectrically insulating material. Energy as an electric field may beelectrostatically stored within such material. Depending on compositionof the insulator material, that stored field will be volatile ornon-volatile. For example, a capacitor insulator material including onlySiO₂ will be volatile. One type of non-volatile capacitor is aferroelectric capacitor which has ferroelectric material as at leastpart of the insulating material. Ferroelectric materials arecharacterized by having two stable polarized states and thereby cancomprise programmable material of a capacitor and/or memory cell. Thepolarization state of the ferroelectric material can be changed byapplication of suitable programming voltages and remains after removalof the programming voltage (at least for a time). Each polarizationstate has a different charge-stored capacitance from the other, andwhich ideally can be used to write (i.e., store) and read a memory statewithout reversing the polarization state until such is desired to bereversed. Less desirable, in some memory having ferroelectric capacitorsthe act of reading the memory state can reverse the polarization.Accordingly, upon determining the polarization state, a re-write of thememory cell is conducted to put the memory cell into the pre-read stateimmediately after its determination. Regardless, a memory cellincorporating a ferroelectric capacitor ideally is non-volatile due tothe hi-stable characteristics of the ferroelectric material that forms apart of the capacitor. Other programmable materials may be used as acapacitor insulator to render capacitors non-volatile.

A field effect transistor is another type of electronic component thatmay be used in a memory cell. These transistors comprise a pair ofconductive source/drain regions having a semiconductive channel regionthere-between. A conductive gate is adjacent the channel region andseparated there-from by a thin gate insulator. Application of a suitablevoltage to the gate allows current to flow from one of the source/drainregions to the other through the channel region. When the voltage isremoved from the gate, current is largely prevented from flowing throughthe channel region. Field effect transistors may also include additionalstructure, for example a reversibly programmable charge-storage regionas part of the gate construction between the gate insulator and theconductive gate. Regardless, the gate insulator may be programmable, forexample being ferroelectric.

Capacitors and transistors may of course be used in integrated circuitryother than memory circuitry.

Silicon dioxide is one insulative material that is commonly used in thefabrication of integrated circuity to provide electrical isolation(insulation) between laterally-adjacent electronic components and as aninterlevel dielectric. Silicon dioxide can be formed in a number ofdifferent manners, including for example initially using a liquidprecursor. Here, a liquid spin-on-dielectric is flowed onto ahorizontally-oriented and spinning wafer and advantageously conformallyfills all gaps. The wafer is heated sufficiently to cause the liquid tosolidify and cause silicon dioxide precursors in the liquid to betransformed into silicon dioxide. The heating is conducted in a furnacethat produces a sufficiently high wafer temperature to cause theformation of silicon dioxide. Unfortunately, the high temperature candamage other structures (e.g., circuit components) that are on thewafer. This can preclude spin-on-dielectric from being used in manyinstances. Accordingly, a need remains for methods that will enablespin-in-dielectrics to be used that don't require high temperature thatcan damage structures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagrammatic cross-sectional view of a substrate fragment inprocess in accordance with an embodiment of the invention.

FIGS. 2-6 are diagrammatic sequential sectional views of theconstruction of FIG. 1 in process in accordance with some embodiments ofthe invention.

FIG. 7 is a diagrammatic cross-sectional view of a substrate fragment inaccordance with an embodiment of the invention.

FIG. 8 is a diagrammatic cross-sectional view of a substrate fragment inaccordance with an embodiment of the invention.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

Embodiments of the invention encompass methods of forming integratedcircuitry, for example comprising one or more vertical transistors, andintegrated circuitry independent of method of manufacture. Integratedcircuitry manufactured in accordance with method embodiments may haveany of the attributes as described herein in structure embodiments. Anyand all embodiments herein may be encompassed by a memory device (e.g.,a memory cell, an array of memory cells, etc.) A first example methodembodiment is described with reference to FIGS. 1-6 .

Referring to FIG. 1 , a starting construction 10 in the fabrication of avertical transistor comprises a base substrate 11 having any one or moreof conductive/conductor/conducting,semiconductive/semiconductor/semiconducting, orinsulative/insulator/insulating (i.e., electrically herein) material(s)12. Various materials have been formed elevationally over base substrate11. Materials may be aside, elevationally inward, or elevationallyoutward of the FIG. 1 -depicted materials. For example, other partiallyor wholly fabricated components of integrated circuitry may be providedsomewhere above, about, or within base substrate 11. The discussioninitially proceeds in the fabrication of only one vertical transistor,although multiple of the same or different construction verticaltransistors may be formed, for example fabricated in an array thatincludes one or more vertical transistors in accordance with theinvention.

A bottom material 50, a top material 54, and a middle material 52vertically between bottom material 50 and top material 54 have beenformed atop base substrate 11. The bottom, top, and middle materialsrespectively comprise a bottom source/drain region 18, a topsource/drain region 16, and a channel region 20 vertically betweenbottom source/drain region 18 and top source/drain region 18 in afinished construction of the vertical transistor. In one embodiment,bottom material 50 has a substantially planar top 56. The exampledepicted components for brevity and clarity are only shown in FIG. 1 asa vertical cross-section. The example source/drain regions and channelregions may be, for example, in the form of coextensive longitudinallyelongated lines running into and out of the plane of the page upon whichFIG. 1 lies. Alternately and by way of example only, such may becircular, rectangular, elliptical, triangular, etc. in horizontalcross-section (not shown). By way of examples only, materials 54, 50,and 52 and therefore regions 16, 18, an 20, respectively, may compriseone or more of appropriately-doped crystalline semiconductor material,such as one or more of silicon, germanium, and so-called III/Vsemiconductor materials (e.g., GaAs, InP, GaP, and GaN), withsource/drain regions 16 and 18 being sufficiently doped to be conductiveand channel region 18 being undoped or sufficiently doped to conduct inan “on” state and to not conduct in an “off” state of the transistor.Desired dopant concentrations may be in materials 50, 52, and 54as-deposited or so provided subsequently. Further, middle material 52and top material 54 may be provided later in processing than as shown.

Referring to FIG. 2 , a liquid comprising spin-on-dielectric 58 has beenflowed onto construction 10 of FIG. 1 to be laterally-aside bottommaterial 50. Any existing or future-developed spin-on-dielectric may beused.

Referring to FIG. 3 , spin-on-dielectric 58 (not shown) has beensubjected to microwave annealing (diagrammatically indicated by arrows60) to form insulative silicon dioxide 62 having a substantially planartop 64 that is adjacent substantially planar top 56 of bottom material50. Insulative silicon dioxide 62 has at least one of (a) and (b), where

-   -   (a): an average concentration of elemental-form H of 0.002 to        0.5 atomic percent; and    -   (b): an average concentration of elemental-form N of 0.005 to        0.3 atomic percent.        In one ideal embodiment, planar top 64 of insulative silicon        dioxide 62 and planar top 56 of bottom material 50 are each        horizontal and are coplanar (as shown). Regardless, during        transformation of spin-on-dielectric 58 of FIG. 2 to insulative        silicon dioxide 62 of FIG. 3 , densification may occur whereby        thickness of the initially-formed spin-on-dielectric reduces.        Accordingly, initial thickness of spin-on-dielectric 58 may        ideally be greater than that shown in FIG. 2 to achieve the        construction of FIG. 3 . By way of examples only, microwave        power during the microwave annealing is 100 watts to 20,000        watts and time of microwave annealing is 10 seconds to 2 hours,        with of course lower power taking longer to achieve desired        precursor transformation and final silicon dioxide density. The        microwave power may be constant or variable during the microwave        annealing and may be cyclic in variable power (e.g., including        multiple time-spaced microwave annealing steps where microwave        power is 0 watts between steps).

In one embodiment, insulative silicon dioxide 62 comprises (a). In onesuch embodiment, the average concentration of elemental-form H is 0.002to 0.25 atomic percent, and in one such embodiment is 0.002 to 0.1atomic percent. In one embodiment, all of insulative silicon dioxide 62that is laterally-aside bottom material 50 has the concentration ofelemental-form H of 0.002 to 0.5 atomic percent.

In one embodiment, insulative silicon dioxide comprises (b). In one suchembodiment, the average concentration of elemental-form N is 0.005 to0.15 atomic percent, and in one such embodiment is 0.005 to 0.0075atomic percent. In one embodiment, all of insulative silicon dioxide 62that is laterally-aside bottom material 50 has the concentration ofelemental-form N of 0.005 to 0.3 atomic percent. In one idealembodiment, insulative silicon dioxide 62 that is laterally-aside bottommaterial 50 comprises (a) and (b).

In one embodiment, conductive material is ultimately formed againstsubstantially planar top 64 of insulative silicon dioxide 62 to form agate operatively aside middle material 52. One example embodiment ofdoing so is described with reference to FIGS. 4-6 and another exampleembodiment with reference to FIG. 7 .

Referring to FIG. 4 , a gate insulator 24 (e.g., silicon dioxide,silicon nitride, high-k material, and/or ferroelectric material) hasbeen conformally deposited over the construction of FIG. 3 and therebyat least laterally-over channel region 20. As an alternate example offorming gate insulator 24, sidewalls of middle material 52 may beoxidized or nitridated to form gate insulator 24 (regardless of whethersuch forms over sidewalls and the uppermost surface of top material 54).

Referring to FIG. 5 , and in one embodiment, gate insulator 24 has beensubstantially removed from being over horizontal surfaces (e.g., byanisotropic spacer-like etching) except whereimmediately-laterally-adjacent sidewalls of middle material 52 and topmaterial 54. Gate insulator 24 could also be removed to not be oversidewalls of top material 54 (e.g., by continued anisotropic etching,and not shown).

Referring to FIG. 6 , a gate 22 (i.e., conductive material) has beenformed laterally-adjacent (laterally-aside) channel region 20, with gateinsulator 24 being there-between, thus completing construction of avertical transistor 14. Such may be formed, for example, by depositingthe conductive material of gate 22 conformally over the construction ofFIG. 5 followed by anisotropic spacer-like etching of such conductingmaterial to produce gate construction 22 as shown. In one embodiment,gate 22 has a substantially planar bottom surface 68 that is adjacent asubstantially planar bottom surface 70 of middle material 52. In onesuch embodiment and as shown, substantially planar bottom surface 68 ofgate 22 and substantially planar bottom surface 70 of middle material 52are each horizontal and are coplanar. Gate insulator 24 and/or gate 22may peripherally encircle the depicted structure or alternately, by wayof example only, be only partially around such structure or only on onelateral-side in vertical cross-section (not shown). Example insulatormaterial 72 has subsequently been formed over vertical transistor 44 andplanarized back at least to an uppermost surface of top material 54.Insulator material 72 may be of the same composition as or comprise adifferent composition from that of insulative silicon dioxide 62 and maybe deposited by the same of different manner.

Any other attribute(s) or aspect(s) as shown and/or described hereinwith respect to other embodiments may be used in the embodiments shownand described with reference to the above embodiments.

FIG. 7 shows an alternate embodiment construction 10 a. Like numeralsfrom the above-described embodiments have been used where appropriate,with some construction differences being indicated with the suffix “a”or with different numerals. In vertical transistor 14 a, gate insulator24 has not been processed as shown in FIG. 5 prior to depositing theconductive material of gate 22 a. Gate 22 a has its substantially planarbottom surface 68 adjacent substantially planar bottom surface 70 ofmiddle material 52, but here where planar horizontal bottom surface 68of gate 22 a is higher than planar horizontal bottom surface 70 ofmiddle material 52. Any other attribute(s) or aspect(s) as shown and/ordescribed herein with respect to other embodiments may be used.

Embodiments of the invention include methods used in the fabrication ofintegrated circuitry independent of whether such includes a verticaltransistor or other construction(s) as shown and described with respectto FIGS. 1-7 above. Such comprise flowing a liquid comprisingspin-on-dielectric (e.g., 58) onto a substrate (e.g., 11) comprisingelectronic components (e.g., any existing or future electronic componentthat may not be completely fabricated at this point of processing, forexample all or part of a resistor, capacitor, transistor, diode, etc.).The spin-on-dielectric is microwave annealed (e.g., as indicated byarrows 60 in FIG. 3 ) to form insulative silicon dioxide (e.g., 62)having at least one of (a) and (b), where:

-   -   (a): an average concentration of elemental-form H of 0.002 to        0.5 atomic percent; and    -   (b): an average concentration of elemental-form N of 0.005 to        0.3 atomic percent.        Any other attribute(s) or aspect(s) as shown and/or described        herein with respect to other embodiments may be used.

Method embodiments of the invention may enable use ofspin-on-dielectrics that achieve final desired composition and densitywithout heating the substrate as high as furnace annealing does, andthereby reduce risk of damaging previously fabricated components thatare on the substrate.

Alternate embodiment constructions may result from method embodimentsdescribed above, or otherwise. Regardless, embodiments of the inventionencompass integrated circuitry independent of method of manufacture.Nevertheless, such integrated circuitry may have any of the attributesas described herein in method embodiments. Likewise, the above-describedmethod embodiments may incorporate, form, and/or have any of theattributes described with respect to device embodiments.

In one embodiment, integrated circuitry (e.g., a portion of such shownin FIG. 6 and in FIG. 7 ) comprises a vertical transistor (e.g., 14, 14a) comprising a top source/drain region (e.g., 16), a bottomsource/drain region (e.g., 18), a channel region (e.g., 20) verticallybetween the top and bottom source/drain regions, and a gate (e.g., 22)operatively laterally-aside the channel region. Such integratedcircuitry also comprises insulative silicon dioxide (e.g., 62) that isboth directly under the gate and laterally-aside the bottom source/drainregion. The insulative silicon dioxide having at least one of (a) and(b), where:

-   -   (a): an average concentration of elemental-form H of 0.002 to        0.5 atomic percent; and    -   (b): an average concentration of elemental-form N of 0.005 to        0.3 atomic percent.        Any other attribute(s) or aspect(s) as shown and/or described        herein with respect to other embodiments may be used.

In one embodiment, integrated circuitry (regardless of whethercomprising a vertical transistor) comprises an electronic component(e.g., 14, 14 a). Insulative silicon dioxide (e.g., 62) is adjacent theelectronic component. The insulative silicon dioxide has at least one of(a) and (b), where:

-   -   (a): an average concentration of elemental-form H of 0.002 to        0.5 atomic percent; and    -   (b): an average concentration of elemental-form N of 0.005 to        0.3 atomic percent.        Any other attribute(s) or aspect(s) as shown and/or described        herein with respect to other embodiments may be used.

An additional construction 10 b in accordance with an embodiment of theinvention is shown in FIG. 8 . Like numerals from the above-describedembodiments have been used where appropriate, with some differences fromconstruction 10 being indicated with the suffix “b”, “L”, “U”, or withdifferent numerals. Construction 10 b comprises an example stack 26comprising tiers 28, 30, and 32. Construction 10 b may have more tiersthan shown. The integrated circuitry of construction 10 b comprises alower array 34 comprising vertical transistors 14L. Such transistorsindividually comprise a lower-array top source/drain region 16L, alower-array bottom source/drain region 18L, a lower-array channel region20L vertically between the lower-array top and bottom source/drainregions, and a lower-array gate 22L operatively laterally-adjacentlower-array channel region 20L. Regions 18L, 16L, 20L, and 22L oflower-array vertical transistors 14L may have any of the attributesdescribed above with respect to 18, 16, 20, and 22, respectively.Lower-array insulative silicon dioxide 62L is both directly underlower-array gates 22L and laterally-aside lower-array bottomsource/drain regions 18L.

Integrated circuitry of construction 10 b comprises an upper array 36 ofvertical transistors 14U spaced above lower array 34 of verticaltransistors 14L. Upper-array vertical transistors 14U individuallycomprise an upper-array top source/drain region 16U, an upper-arraybottom source/drain region 18U, an upper-array channel region 20Uvertically between the upper-array top and bottom source/drain regions,and an upper-array gate 22U operatively laterally adjacent upper-arraychannel region 20U. Regions 18U, 16U, 20U, and 22U of upper-arrayvertical transistors 14U may have any of the attributes described abovewith respect to 18, 16, 20, and 22, respectively. Upper-array insulativesilicon dioxide 62U is both directly under upper-array gates 22U andlaterally-aside upper-array bottom source/drain regions 16U. Insulatingmaterial 38 (e.g., silicon dioxide and/or silicon nitride) is verticallybetween and spaces lower array 34 and upper array 36 relative oneanother (e.g., being a tier 30 separating tiers 28 and 32).

At least one of lower-array insulative silicon dioxide 62L andupper-array insulative silicon dioxide 62U has at least one of (a) and(b), where:

-   -   (a): an average concentration of elemental-form H of 0.002 to        0.5 atomic percent; and    -   (b): an average concentration of elemental-form N of 0.005 to        0.3 atomic percent.        In one embodiment, lower array 34 comprises at least one of (a)        and (b), and in one embodiment comprises both of (a) and (b). In        one embodiment, upper array 36 comprises at least one of (a) and        (b), and in one embodiment comprises both of (a) and (b). In one        embodiment, lower array 34 and upper array 36 each comprise at        least one of (a) and (b), and in one embodiment lower array 34        and upper array 36 each comprise both of (a) and (b).

Upper-array silicon dioxide 62U and/or lower-array silicon dioxide 62Lmay be manufactured in accordance with method embodiments as describedherein, or otherwise. Method embodiments herein encompass forming one orboth of materials 62L and 62U in a construction 10 b as shown.

Any other attribute(s) or aspect(s) as shown and/or described hereinwith respect to other embodiments may be used.

The above processing(s) or construction(s) may be considered as beingrelative to an array of components formed as or within a single stack orsingle deck or within two stacks or two decks of such components aboveor as part of an underlying base substrate (albeit, the singlestack/deck and/or two stacks/decks may each have multiple tiers).Control and/or other peripheral circuitry for operating or accessingsuch components within an array may also be formed anywhere as part ofthe finished construction, and in some embodiments may be under thearray (e.g., CMOS under-array). Regardless, one or more additional suchstack(s)/deck(s) may be provided or fabricated above and/or below thatshown in the figures or described above. Further, the array(s) ofcomponents may be the same or different relative one another indifferent stacks/decks and different stacks/decks may be of the samethickness or of different thicknesses relative one another. Interveningstructure may be provided between immediately-vertically-adjacentstacks/decks (e.g., additional circuitry and/or dielectric layers).Also, different stacks/decks may be electrically coupled relative oneanother. The multiple stacks/decks may be fabricated separately andsequentially (e.g., one atop another), or two or more stacks/decks maybe fabricated at essentially the same time.

The assemblies and structures discussed above may be used in integratedcircuits/circuitry and may be incorporated into electronic systems. Suchelectronic systems may be used in, for example, memory modules, devicedrivers, power modules, communication modems, processor modules, andapplication-specific modules, and may include multilayer, multichipmodules. The electronic systems may be any of a broad range of systems,such as, for example, cameras, wireless devices, displays, chip sets,set top boxes, games, lighting, vehicles, clocks, televisions, cellphones, personal computers, automobiles, industrial control systems,aircraft, etc.

In this document unless otherwise indicated, “elevational”, “higher”,“upper”, “lower”, “top”, “atop”, “bottom”, “above”, “below”, “under”,“beneath”, “up”, and “down” are generally with reference to the verticaldirection. “Horizontal” refers to a general direction (i.e., within 10degrees) along a primary substrate surface and may be relative to whichthe substrate is processed during fabrication, and vertical is adirection generally orthogonal thereto. Reference to “exactlyhorizontal” is the direction along the primary substrate surface (i.e.,no degrees there-from) and may be relative to which the substrate isprocessed during fabrication. Further, “vertical” and “horizontal” asused herein are generally perpendicular directions relative one anotherand independent of orientation of the substrate in three-dimensionalspace. Additionally, “elevationally-extending” and “extend(ing)elevationally” refer to a direction that is angled away by at least 45°from exactly horizontal. Further, “extend(ing) elevationally”,“elevationally-extending”, “extend(ing) horizontally”,“horizontally-extending” and the like with respect to a field effecttransistor are with reference to orientation of the transistor's channellength along which current flows in operation between the source/drainregions. For bipolar junction transistors, “extend(ing) elevationally”“elevationally-extending”, “extend(ing) horizontally”,“horizontally-extending” and the like, are with reference to orientationof the base length along which current flows in operation between theemitter and collector. In some embodiments, any component, feature,and/or region that extends elevationally extends vertically or within10° of vertical.

Further, “directly above”, “directly below”, and “directly under”require at least some lateral overlap (i.e., horizontally) of two statedregions/materials/components relative one another. Also, use of “above”not preceded by “directly” only requires that some portion of the statedregion/material/component that is above the other be elevationallyoutward of the other (i.e., independent of whether there is any lateraloverlap of the two stated regions/materials/components). Analogously,use of “below” and “under” not preceded by “directly” only requires thatsome portion of the stated region/material/component that is below/underthe other be elevationally inward of the other (i.e., independent ofwhether there is any lateral overlap of the two statedregions/materials/components).

Any of the materials, regions, and structures described herein may behomogenous or non-homogenous, and regardless may be continuous ordiscontinuous over any material which such overlie. Where one or moreexample composition(s) is/are provided for any material, that materialmay comprise, consist essentially of, or consist of such one or morecomposition(s). Further, unless otherwise stated, each material may beformed using any suitable existing or future-developed technique, withatomic layer deposition, chemical vapor deposition, physical vapordeposition, epitaxial growth, diffusion doping, and ion implanting beingexamples.

Additionally, “thickness” by itself (no preceding directional adjective)is defined as the mean straight-line distance through a given materialor region perpendicularly from a closest surface of animmediately-adjacent material of different composition or of animmediately-adjacent region. Additionally, the various materials orregions described herein may be of substantially constant thickness orof variable thicknesses. If of variable thickness, thickness refers toaverage thickness unless otherwise indicated, and such material orregion will have some minimum thickness and some maximum thickness dueto the thickness being variable. As used herein, “different composition”only requires those portions of two stated materials or regions that maybe directly against one another to be chemically and/or physicallydifferent, for example if such materials or regions are not homogenous.If the two stated materials or regions are not directly against oneanother, “different composition” only requires that those portions ofthe two stated materials or regions that are closest to one another bechemically and/or physically different if such materials or regions arenot homogenous. In this document, a material, region, or structure is“directly against” another when there is at least some physical touchingcontact of the stated materials, regions, or structures relative oneanother. In contrast, “over”, “on”, “adjacent”, “along”, and “against”not preceded by “directly” encompass “directly against” as well asconstruction where intervening material(s), region(s), or structure(s)result(s) in no physical touching contact of the stated materials,regions, or structures relative one another.

Herein, regions-materials-components are “electrically coupled” relativeone another if in normal operation electric current is capable ofcontinuously flowing from one to the other and does so predominately bymovement of subatomic positive and/or negative charges when such aresufficiently generated. Another electronic component may be between andelectrically coupled to the regions-materials-components. In contrast,when regions-materials-components are referred to as being “directlyelectrically coupled”, no intervening electronic component (e.g., nodiode, transistor, resistor, transducer, switch, fuse, etc.) is betweenthe directly electrically coupled regions-materials-components.

Any use of “row” and “column” in this document is for convenience indistinguishing one series or orientation of features from another seriesor orientation of features and along which components have been or maybe formed. “Row” and “column” are used synonymously with respect to anyseries of regions, components, and/or features independent of function.Regardless, the rows may be straight and/or curved and/or paralleland/or not parallel relative one another, as may be the columns.Further, the rows and columns may intersect relative one another at 90°or at one or more other angles (i.e., other than the straight angle).

The composition of any of the conductive/conductor/conducting materialsherein may be metal material and/or conductively-dopedsemiconductive/semiconductor/semiconducting material. “Metal material”is any one or combination of an elemental metal, any mixture or alloy oftwo or more elemental metals, and any one or more conductive metalcompound(s).

Herein, any use of “selective” as to etch, etching, removing, removal,depositing, forming, and/or formation is such an act of one statedmaterial relative to another stated material(s) so acted upon at a rateof at least 2:1 by volume. Further, any use of selectively depositing,selectively growing, or selectively forming is depositing, growing, orforming one material relative to another stated material or materials ata rate of at least 2:1 by volume for at least the first 75 Angstroms ofdepositing, growing, or forming.

Unless otherwise indicated, use of “or” herein encompasses either andboth.

Conclusion

In some embodiments, integrated circuitry comprises an electroniccomponent. Insulative silicon dioxide is adjacent the electroniccomponent. The insulative silicon dioxide has at least one of (a) and(b), where: (a): an average concentration of elemental-form H of 0.002to 0.5 atomic percent; and (b): an average concentration ofelemental-form N of 0.005 to 0.3 atomic percent.

In some embodiments, a memory device comprising a vertical transistorcomprises a top source/drain region, a bottom source/drain region, achannel region vertically between the top and bottom source/drainregions, and a gate operatively laterally-aside the channel region.Insulative silicon dioxide is both directly under the gate andlaterally-aside the bottom source/drain region. The insulative silicondioxide has at least one of (a) and (b), where: (a): an averageconcentration of elemental-form H of 0.002 to 0.5 atomic percent; and(b): an average concentration of elemental-form N of 0.005 to 0.3 atomicpercent.

In some embodiments, integrated circuitry comprises a lower arraycomprising vertical transistors. The lower-array vertical transistorsindividually comprise a lower-array top source/drain region, alower-array bottom source/drain region, a lower-array channel regionvertically between the lower-array top and bottom source/drain regions,and a lower-array gate operatively laterally-aside the lower-arraychannel region. Lower-array insulative silicon dioxide is both directlyunder the lower-array gates and laterally-aside the lower-array bottomsource/drain regions. An upper array of vertical transistors is spacedabove the lower array of vertical transistors. The upper-array verticaltransistors individually comprise an upper-array top source/drainregion, an upper-array bottom source/drain region, an upper-arraychannel region vertically between the upper-array top and bottomsource/drain regions, and an upper-array gate operativelylaterally-aside the upper-array channel region. Upper-array insulativesilicon dioxide is both directly under the upper-array gates andlaterally-aside the upper-array bottom source/drain regions. Insulatingmaterial is vertically between and space the lower and upper arraysrelative one another. At least one of the lower-array insulative silicondioxide and the upper-array insulative silicon dioxide have at least oneof (a) and (b), where: (a): an average concentration of elemental-form Hof 0.002 to 0.5 atomic percent; and (b): an average concentration ofelemental-form N of 0.005 to 0.3 atomic percent.

In some embodiments, a method used in the fabrication of integratedcircuitry comprises flowing a liquid comprising spin-on-dielectric ontoa substrate comprising electronic components. The spin-on-dielectric ismicrowave annealed to form insulative silicon dioxide having at leastone of (a) and (b), where: (a): an average concentration ofelemental-form H of 0.002 to 0.5 atomic percent; and (b): an averageconcentration of elemental-form N of 0.005 to 0.3 atomic percent.

In some embodiments, a method used in the fabrication of a verticaltransistor comprises forming a bottom material, a top material, and amiddle material vertically between the bottom and top materials. Thebottom, top, and middle materials respectively comprise a bottomsource/drain region, a top source/drain region, and a channel regionvertically between the bottom and top source/drain regions in a finishedconstruction of the vertical transistor. The bottom material has asubstantially planar top. A liquid comprising spin-on-dielectric isflowed to be laterally-aside the bottom material. The spin-on-dielectricis microwave annealed to form insulative silicon dioxide that has asubstantially planar top that is adjacent the substantially planar topof the bottom material. The insulative silicon dioxide has at least oneof (a) and (b), where: (a): an average concentration of elemental-form Hof 0.002 to 0.5 atomic percent; and (b): an average concentration ofelemental-form N of 0.005 to 0.3 atomic percent. Conductive material isformed against the substantially planar top of the insulative silicondioxide to form a gate operatively aside the middle material.

In compliance with the statute, the subject matter disclosed herein hasbeen described in language more or less specific as to structural andmethodical features. It is to be understood, however, that the claimsare not limited to the specific features shown and described, since themeans herein disclosed comprise example embodiments. The claims are thusto be afforded full scope as literally worded, and to be appropriatelyinterpreted in accordance with the doctrine of equivalents.

1-11. (canceled)
 12. Integrated circuitry comprising: a lower arraycomprising vertical transistors; the lower-array vertical transistorsindividually comprising a lower-array top source/drain region, alower-array bottom source/drain region, a lower-array channel regionvertically between the lower-array top and bottom source/drain regions,and a lower-array gate operatively laterally-aside the lower-arraychannel region; lower-array insulative silicon dioxide that is bothdirectly under the lower-array gates and laterally-aside the lower-arraybottom source/drain regions; an upper array of vertical transistorsspaced above the lower array of vertical transistors, the upper-arrayvertical transistors individually comprising an upper-array topsource/drain region, an upper-array bottom source/drain region, anupper-array channel region vertically between the upper-array top andbottom source/drain regions, and an upper-array gate operativelylaterally-aside the upper-array channel region; upper-array insulativesilicon dioxide that is both directly under the upper-array gates andlaterally-aside the upper-array bottom source/drain regions; insulatingmaterial vertically between and spacing the lower and upper arraysrelative one another; and at least one of the lower-array insulativesilicon dioxide and the upper-array insulative silicon dioxide having atleast one of (a) and (b), where: (a): an average concentration ofelemental-form H of 0.002 to 0.5 atomic percent; and (b): an averageconcentration of elemental-form N of 0.005 to 0.3 atomic percent. 13.The integrated circuitry of claim 12 wherein the lower array comprisesthe at least one of (a) and (b).
 14. The integrated circuitry of claim12 wherein the upper array comprises the at least one of (a) and (b).15. The integrated circuitry of claim 12 wherein the lower arraycomprises the at least one of (a) and (b) and the upper array comprisesthe at least one of (a) and (b). 16-24. (canceled)